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ATOMIC LAYER DEPOSITION COATINGS

ALD Coating Services for Electronics

Our ALD technology allows for precise and uniform thin film deposition on various substrates and protects against moisture, radiation, outgassing, environmental threats, and unwanted oxidation and contamination.

What is Atomic Layer Deposition? 

Atomic Layer Deposition (ALD) is a thin film deposition technique that enables precise and conformal coating of materials onto various substrates. It is a variant of the chemical vapor deposition (CVD) process that involves alternating reactants that react with the surface of the substrate, creating a self-limiting chemical reaction that causes a thin film to form. 

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ALD thin films are crafted in cycles. The electronic component surface is exposed to various vapors and gases in alternating, separated doses.

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During each coating period, a thin layer of material forms. After forming a chemical bond with the substrate, the reactive vapor or gas is purged from the chamber with a non-reactive gas.

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3

A second reactive gas, chosen to complement the process, is pulsed into the chamber next at a precisely controlled amount.

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The process of 'purge and repeat' continues until a desired film thickness is achieved.

What are the Benefits of ALD Coating Services?

ALD coatings are highly precise and uniform, with thicknesses that range from a few atomic layers to several microns. The process is ideal for depositing thin films onto complex geometries and high aspect ratio structures without voids or defects.

Other ALD benefits include:

Accuracy and Precision

ALD is a highly precise technique for depositing thin films, allowing for accurate film thickness and composition control. It enables the deposition of uniform films with excellent reproducibility.

Thickness Control

ALD allows for precise film thickness control at the atomic level, enabling the deposition of ultra-thin films. 

Conformal Deposition

ALD coatings can conformally coat high aspect ratio structures and complex geometries without defects or voids.

Cost Effective

ALD coatings can be produced at relatively low temperatures, which reduces energy consumption and lowers production costs. Additionally, precise film thickness control reduces material waste and increases yield.

Wide Range of Materials

A wide range of materials can be deposited, such as metals (e.g., lithium, zinc), metal oxides (e.g., aluminum oxide, titanium dioxide, titanium oxide), metal nitrides, and metal sulfides. ALD creates multifunctional coatings with tailored properties for specific applications and is compatible with various substrates, including silicon, glass, ceramics, and metals.

High Quality

The coatings have high film quality, low defect density, and excellent adhesion to substrates. They also have excellent thermal and chemical stability, ideal for harsh environments.

Environmentally Friendly

ALD is an environmentally friendly technique that does not produce any hazardous by-products or waste. The process uses low amounts of chemicals, making it an ideal solution for green manufacturing.

Common Applications
of ALD Coating

ALD is widely used in various industries, including semiconductor manufacturing, energy storage, and medical device production. Applications include:

Semiconductor Manufacturing

ALD coatings are widely used in producing semiconductor devices, including transistor gate dielectrics, capacitors, and interconnects.

Energy Storage

ALD coatings can improve the performance of energy storage devices, including rechargeable battery materials and supercapacitors.

Medical Devices

ALD coatings can enhance medical implants' biocompatibility and corrosion resistance.

Optical Coatings

ALD can produce optical coatings for various applications, such as anti-reflection, thin-film solar cells, and more.

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Additional Resources

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Download HZO Sentinel EX™ Nanocoating Material Properties Datasheet

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Mechanical Seals And HZO Coating Comparison Demo

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